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Document Title
256K x16 bit Low Power and Low Voltage Full CMOS Static RAM
EM641FP16 Series
Low Power, 256Kx16 SRAM
Revision History
Revision No.
0.0 0.1 0.2
History
Initial Draft 2'nd Draft 3' Draft rd Changed Icc, Icc1 value Changed ISB1 test conditions, Changed VDR & IDR measurement condition
Draft Date
October 24 , 2002 November 11 , 2002 December 23 , 2002
Remark
Preliminary
0.3
4'th Draft
Add Pb-free part number
February 13 , 2004
Emerging Memory & Logic Solutions Inc.
IT Venture Tower Eastside 11F, 78, Karac-Dong, Songpa-Ku, Seoul, Rep.of Korea Zip Code : 138-160 Tel : +82-2-2142-1759~1766 Fax : +82-2-2142-1769 / Homepage : www.emlsi.com The attached datasheets are provided by EMLSI reserve the right to change the specifications and products. EMLSI will answer to your questions about device. If you have any questions, please contact the EMLSI office. 1
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FEATURES
* * * * * * Process Technology : 0.18m Full CMOS Organization : 256K x 16 bit Power Supply Voltage : 1.65V ~ 2.2V Low Data Retention Voltage : 1.0V(Min.) Three state outputs Package Type : 48-FPBGA 6.0x7.0
EM641FP16 Series
Low Power, 256Kx16 SRAM
GENERAL DESCRIPTION
The EM641FP16 families are fabricated by EMLSI's advanced full CMOS process technology. The families support industrial temperature range and Chip Scale Package for user flexibility of system design. The families also supports low data retention voltage for battery back-up operation with low data retention current.
PRODUCT FAMILY
Power Dissipation Product Family Operating Temperature Vcc Range Speed Standby (ISB1 , Typ.) 1 A Operating (ICC1.Max) 2 mA PKG Type 48-FPBGA (6.0x7.0)
EM641FP16
Industrial (-40 ~ 85o C)
1.65~2.2V
70ns1 )
1. The parameter is measured with 30pF test load.
PIN DESCRIPTION
1 A B C D E F G H 2 3 4 5 6
FUNCTIONAL BLOCK DIAGRAM
Pre-charge Circuit
LB I/O 9
OE UB
A0 A3 A5 A17 DNU A14 A12 A9
A1 A4 A6 A7 A16 A15 A13 A10
A2 CS I/O2 I/O4 I/O5 I/O6 WE A11
DNU I/O1 I/O3 VCC V SS I/O7 I/O8 DNU
A11 A A A14 A A A17 12 13 15 16 A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 VC C
Row S elect
VSS
Memory Array 2048 x 2048
I/O10 I/O11 V SS VC C I/O12 I/O13
I/O1 ~ I/O8 I/O9 ~ I/O16
Data Cont Data Cont
I/O Circuit Column Select
I/O15 I/O14 I/O16 DNU DNU A8
48-FPBGA : Top view (ball down)
W E O E UB LB
Control Logic
Name CS OE WE A 0 ~A17
Function Chip select input Output Enable input Write Enable input Address Inputs
Name Vcc Vss UB LB DNU
Function Power Supply Ground Upper Byte (I/O 9~16) Lower Byte (I/O 1~8 ) Do Not Use
CS
I/O1 ~I/O 16 Data Inputs/outputs
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ABSOLUTE MAXIMUM RATINGS * Parameter
Voltage on Any Pin Relative to Vss Voltage on Vcc supply relative to Vss Power Dissipation Operating Temperature
EM641FP16 Series
Low Power, 256Kx16 SRAM
Symbol
VIN , VOUT VCC PD TA
Minimum
-0.5 to 2.5V -0.3 to 2.5V 1.0 -40 to 85
Unit
V V W
oC
* Stresses greater than those listed above "Absolute Maximum Ratings" may cause permanent damage to the device. Functional operation should be restricted to recommended operating condition. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
FUNCTIONAL DESCRIPTION
CS H X L L L L L L L L OE X X H H L L L X X X WE X X H H H H H L L L LB X H L X L H L L H L UB X H X L H L L H L L I/O 1-8 High-Z High-Z High-Z High-Z Data Out High-Z Data Out Data In High-Z Data in I/O9-16 High-Z High-Z High-Z High-Z High-Z Data Out Data Out High-Z Data In Data In Mode Deselected Deselected Output Disabled Output Disabled Lower Byte Read Upper Byte Read Word Read Lower Byte Write Upper Byte Write Word Write Power Stand by Stand by Active Active Active Active Active Active Active Active
Note: X means don't care. (Must be low or high state)
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RECOMMENDED DC OPERATING CONDITIONS 1)
Parameter Supply voltage Ground Input high voltage Input low voltage
1. 2. 3. 4.
EM641FP16 Series
Low Power, 256Kx16 SRAM
Symbol VCC VSS VIH VIL
Min 1.65 0 1.4 -0.33)
Typ 1.8 0 -
Max 2.2 0 VCC + 0.3 2) 0.4
Unit V V V V
TA= -40 to 85oC, otherwise specified Overshoot: VCC +1.0 V in case of pulse width < 20ns Undershoot: -1.0 V in case of pulse width < 20ns Overshoot and undershoot are sampled, not 100% tested.
CAPACITANCE 1) (f =1MHz, TA=25oC)
Item Input capacitance Input/Ouput capacitance
1. Capacitance is sampled, not 100% tested
Symbol C IN CIO
Test Condition VIN=0V VIO =0V
Min -
Max 8 10
Unit pF pF
DC AND OPERATING CHARACTERISTICS
Parameter Input leakage current Output leakage current Operating power supply Symbol ILI ILO I CC ICC1 Average operating current ICC2 Output low voltage Output high voltage VOL VOH
V IN=V SS to V CC CS = VIH or OE=V IH or WE=V IL, LB=UB=VIH , V IO =VSS to V CC IIO =0mA, CS = VIL , VIN = VIH or VIL Cycle time=1s, 100% duty, IIO=0mA, CS <0.2V, LB<0.2V or/and UB<0.2V, V IN< 0.2V or VIN >V CC-0.2V Cycle time = Min, I IO =0mA, 100% duty, CS = VIL, LB=VIL or/and UB=V IL, VIN=V IL or VIH IOL = 2.1mA IOH = -1.0mA CS >V CC-0.2V(CS controlled) or
Test Conditions
Min -1 -1 -
Typ -
Max 1 1 2 2
Unit uA uA mA mA
1.4
-
12 0.2 -
mA V V
Standby Current (CMOS)
ISB1
LB=UB V CC-0.2V, CS<0.2V(LB/UB Controlled) Other inputs=0~VCC (Typ. condition : V CC =1.8V @ 25o C) (Max. condition : VCC=2.2V @ 85 oC)
LL LF
-
1
5
uA
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AC OPERATING CONDITIONS
Test Conditions (Test Load and Test Input/Output Reference) Input Pulse Level : 0.2 to VCC-0.2V Input Rise and Fall Time : 5ns Input and Output reference Voltage : 0.9V Output Load (See right) : CL = 100pF+ 1 TTL CL1) = 30pF + 1 TTL 1. Including scope and Jig capacitance 2. R1=3070 ohm, R2 =3150 ohm 3. VTM=1.8V
EM641FP16 Series
Low Power, 256Kx16 SRAM
VTM 3) R12)
CL1)
R22)
READ CYCLE (V cc =1.65 to 2.2V, Gnd = 0V, TA = -40oC to +85oC)
Parameter
Read Cycle Time Address Access Time Chip Select to output Output Enable to valid output UB, LB Acess time Chip select to low-Z output UB, LB enable to low-Z output Output Enable to Low-Z output Chip disable to high-Z output UB, LB disable to high-Z output Output disable to high-Z output Output hold from address change
Symbol
tRC tA A tCO tOE tB A tLZ tBLZ tOLZ tHZ tBHZ tOHZ tOH
70ns Min 70 Max 70 70 35 70 10 10 5 0 0 0 10 25 25 25 -
Unit
ns ns ns ns ns ns ns ns ns ns ns ns
WRITE CYCLE (Vcc =1.65 to 2.2V, Gnd = 0V, TA = -40oC to +85oC)
Parameter
Write Cycle Time Chip Select to end of write Address Setup time Address valid to end of write UB, LB valid to end of write Write pulse width Write recovery time Write to ouput high-Z Data to write time overlap Data hold from write time End write to output low-Z
Symbol
tWC tCW tAs tAW tBW tWP tWR tWHZ tDW tDH tOW
70ns Min 70 60 0 60 60 55 0 0 30 0 5 Max 25
Unit
ns ns ns ns ns ns ns ns ns ns ns
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TIMING DIAGRAMS
TIMING WAVEFORM OF READ CYCLE(1).
EM641FP16 Series
Low Power, 256Kx16 SRAM
(Address Controlled, CS=OE=V IL, WE=V IH, UB or/and LB= VIL)
tRC Address tAA tOH Data Out
Previous Data Valid Data Valid
TIMING WAVEFORM OF READ CYCLE(2) (WE = VIH)
tRC Address tAA CS tCO tB A UB ,LB tO E OE tOLZ Data Out High-Z
Data Valid
tOH
tHZ
tBHZ
tOHZ
tBLZ tLZ
NOTES (READ CYCLE) 1. t HZ and tOHZ are defined as the outputs achieve the open circuit conditions and are not referanced to output voltage levels. 2. At any given temperature and voltage condition, t HZ(Max.) is less than t LZ(Min.) both for a given device and from device to device interconnection.
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TIMING WAVEFORM OF WRITE CYCLE(1) (WE CONTROLLED)
tWC Address tCW (2) CS tAW tBW UB ,LB tWP (1) WE tAS(3) Data in High-Z tDW
EM641FP16 Series
Low Power, 256Kx16 SRAM
tWR (4)
tDH High-Z tOW
Data Valid
tWHZ Data out Data Undefined
TIMING WAVEFORM OF WRITE CYCLE(2) (CS CONTROLLED)
tWC Address tAS(3) CS tAW tBW UB,LB tWP (1) WE tDW Data in
Data Valid
tCW (2)
tWR (4)
tDH
Data out
High-Z
High-Z
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TIMING WAVEFORM OF WRITE CYCLE(3) (UB, LB CONTROLLED)
EM641FP16 Series
Low Power, 256Kx16 SRAM
tWC Address tCW(2) CS tA W tB W UB ,LB tA S(3) WE tDW Data in Data out High-Z
Data Valid
tW R(4)
tW P(1)
tDH
High-Z
NOTES (WRITE CYCLE) 1. A write occurs during the overlap(tWP ) of low CS and low WE. A write begins when CS goes low and WE goes low with asserting UB or LB for single byte operation or simultaneously asserting UB and LB for double byte operation. A write ends at the earliest transition when CS goes high and WE goes high. The tWP is measured from the beginning of write to the end of write. 2. t CW is measured from the CS going low to end of write. 3. t A S is measured from the address valid to the beginning of write. 4. t WR is measured from the end or write to the address change. tWR applied in case a write ends as CS or WE going high.
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DATA RETENTION CHARACTERISTICS
Parameter
VCC for Data Retention Data Retention Current Chip Deselect to Data Retention Time Operation Recovery Time NOTES
EM641FP16 Series
Low Power, 256Kx16 SRAM
Symbol
VDR IDR tSDR tRDR
Test Condition
ISB1 Test Condition (Chip Disabled)
1)
Min
1.0
Typ
-
Max
2.2
Unit
V
VCC=1.2V, I SB1 Test Condition (Chip Disabled) 1 ) See data retention wave form
0 tRC
0.5 -
2 -
uA
ns -
1. See the IS B 1 measurement condition of datasheet page 4.
DATA RETENTION WAVE FORM
tSDR Vcc 1.65V
Data Retention Mode
tRDR
1.4V VDR
CS > Vcc-0.2V or LB =UB V CC-0.2V
CS,LB/UB GND
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EM641FP16 Series
Low Power, 256Kx16 SRAM
Unit: millimeters
PACKAGE DIMENSION
48 Ball Fine Pitch BGA (0.75mm ball pitch) Top View
B
Bottom View
A1 index Mark
B B1 6 A B C 5 4 3 21
0.5 0.5 Y C1 C B/2
#A1
C
D E C1/2 F G H
Side View
0.26 E2 D
0.25 Typ.
Detail A
A
E E1
Min A B B1 C C1 D E E1 E2 Y 5.95 6.95 0.30 1.00 -
Typ 0.75 6.00 3.75 7.00 5.25 0.35 1.04 0.79 0.25 -
Max 6.05 7.05 0.40 1.10 0.08
NOTES. 1. Bump counts : 48(8row x 6column) 2. Bump pitch : (x,y)=(0.75x0.75) (typ.) 3. All tolerence are +/-0.050 unless otherwise specified. 4. Typ : Typical 5. Y is coplanarity : 0.08(Max)
10
0.79Typ.
C
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MEMORY FUNCTION GUIDE
EM641FP16 Series
Low Power, 256Kx16 SRAM
EM X XX X X X XX X X - XX XX
1. EMLSI Memory 2. Device Type 3. Density 4. Option 5. Technology 6. Operating Voltage
1. Memory Component 2. Device Type 6 ------------------------ Low Power SRAM 7 ------------------------ Pseudo SRAM 3. Density 1 ------------------------- 1M 2 ------------------------- 2M 4 ------------------------- 4M 8 ------------------------- 8M 16 ----------------------- 16M 32 ----------------------- 32M 64 ----------------------- 64M 4. Option 0 ----------------------- Dual CS 1 ----------------------- Single CS 5. Technology Blank ------------------ CMOS F ------------------------ Full CMOS 6. Operating Voltage Blank ------------------- 5V V ------------------------- 3.3V U ------------------------- 3.0V S ------------------------- 2.5V R ------------------------- 2.0V P ------------------------- 1.8V 7. Orginzation 8 ---------------------- x8 bit 16 ---------------------- x16 bit 32 ---------------------- x32 bit 11
11. Power 10. Speed
9. Packages 8. Version 7. Orgainzation
8. Version Blank ----------------- Mother die A ----------------------- First version B ----------------------- Second version C ----------------------- Third version D ----------------------- Fourth version E ----------------------- Fifth version 9. Package Blank ---------------------- Package W --------------------- Wafer 10. Speed 45 ---------------------- 45ns 55 ---------------------- 55ns 70 ---------------------- 70ns 85 ---------------------- 85ns 10 --------------------- 100ns 12 --------------------- 120ns 11. Power LL ---------------------- Low Low Power LF ---------------------- Low Low Power(Pb-Free) L ---------------------- Low Power S ---------------------- Standard Power

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